As the VLSI technology scales down, significant challenges are facing the fabrication, modeling, and performance of the integrated circuits. One of the major challenges for the continuiation of the Moore’s law is “interconnects” at nano-scale. Interconnects become as important as transistors in the current technologies and will dominate the chip performance at the future technologies. Beside their eletrical performance, their mechanical performnace will be important at the nano-scale. Wires should be resilient enough to cope with Back-End-Of-Line (BEOL) processes. Nano-technology has offered us many solutions to current technology problems. One of the major gift of this technology is Carbon Nanotubes (CNT). CNTs are a promising candidate to replace copper interconnects. They not only provide us with ballistic transport for semiconductors, but also have better mechanical performance. In this paper, we study the mechanical reliability of the CNT interconnects and compare it with their copper conterparts.
| Published in | Science Journal of Circuits, Systems and Signal Processing (Volume 3, Issue 4) |
| DOI | 10.11648/j.cssp.20140304.11 |
| Page(s) | 26-30 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2014. Published by Science Publishing Group |
Copper Nano-Wire, Carbon Nanotubes, Fault Tolerance, Interconnections, VLSI
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APA Style
Behzad Lotfy, Houshang Salehi. (2014). Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology. Science Journal of Circuits, Systems and Signal Processing, 3(4), 26-30. https://doi.org/10.11648/j.cssp.20140304.11
ACS Style
Behzad Lotfy; Houshang Salehi. Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology. Sci. J. Circuits Syst. Signal Process. 2014, 3(4), 26-30. doi: 10.11648/j.cssp.20140304.11
AMA Style
Behzad Lotfy, Houshang Salehi. Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology. Sci J Circuits Syst Signal Process. 2014;3(4):26-30. doi: 10.11648/j.cssp.20140304.11
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Download@article{10.11648/j.cssp.20140304.11,
author = {Behzad Lotfy and Houshang Salehi},
title = {Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology},
journal = {Science Journal of Circuits, Systems and Signal Processing},
volume = {3},
number = {4},
pages = {26-30},
doi = {10.11648/j.cssp.20140304.11},
url = {https://doi.org/10.11648/j.cssp.20140304.11},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.cssp.20140304.11},
abstract = {As the VLSI technology scales down, significant challenges are facing the fabrication, modeling, and performance of the integrated circuits. One of the major challenges for the continuiation of the Moore’s law is “interconnects” at nano-scale. Interconnects become as important as transistors in the current technologies and will dominate the chip performance at the future technologies. Beside their eletrical performance, their mechanical performnace will be important at the nano-scale. Wires should be resilient enough to cope with Back-End-Of-Line (BEOL) processes. Nano-technology has offered us many solutions to current technology problems. One of the major gift of this technology is Carbon Nanotubes (CNT). CNTs are a promising candidate to replace copper interconnects. They not only provide us with ballistic transport for semiconductors, but also have better mechanical performance. In this paper, we study the mechanical reliability of the CNT interconnects and compare it with their copper conterparts.},
year = {2014}
}
TY - JOUR T1 - Fault Reduction in Nonoscale VLSI Interconnection by Using Carbon Nanotubes Technology AU - Behzad Lotfy AU - Houshang Salehi Y1 - 2014/11/28 PY - 2014 N1 - https://doi.org/10.11648/j.cssp.20140304.11 DO - 10.11648/j.cssp.20140304.11 T2 - Science Journal of Circuits, Systems and Signal Processing JF - Science Journal of Circuits, Systems and Signal Processing JO - Science Journal of Circuits, Systems and Signal Processing SP - 26 EP - 30 PB - Science Publishing Group SN - 2326-9073 UR - https://doi.org/10.11648/j.cssp.20140304.11 AB - As the VLSI technology scales down, significant challenges are facing the fabrication, modeling, and performance of the integrated circuits. One of the major challenges for the continuiation of the Moore’s law is “interconnects” at nano-scale. Interconnects become as important as transistors in the current technologies and will dominate the chip performance at the future technologies. Beside their eletrical performance, their mechanical performnace will be important at the nano-scale. Wires should be resilient enough to cope with Back-End-Of-Line (BEOL) processes. Nano-technology has offered us many solutions to current technology problems. One of the major gift of this technology is Carbon Nanotubes (CNT). CNTs are a promising candidate to replace copper interconnects. They not only provide us with ballistic transport for semiconductors, but also have better mechanical performance. In this paper, we study the mechanical reliability of the CNT interconnects and compare it with their copper conterparts. VL - 3 IS - 4 ER -
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